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Moldex3D eDesign

eDesign

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Moldex3D/eDesign Ensure Your Design
Moldex3D/eDesign efficiently verifies your part/mold designs through the synergy of true 3D capabilities, parallel computing technology, and a user-friendly workflow.  Not only will you minimize your design cycle and time-to-market, but you will maximize your return on investment – Explore now why Moldex3D/eDesign is your best CAE Strategy.

    

 

Moldex3D/eDesign Feature Highlights:

  • Pioneering 3D Technology—Reliable Results
  • Parallel Computing—High-speed Calculation
  • Intelligence—Cooling & Runner Wizards
  • Flexibility—Optimize Your Design
  • Teamwork—Enhance Cross-department Collaboration

Pioneering 3D Technology—Reliable Results
Although inaccurate results can occur with the “2D + thickness” approach used by others, Moldex3D/eDesign provides reliable results as the first 3D simulation package customized for part/mold design teams.  Equipped with a pioneering 3D kernel and meshing engine, you can be confident with the results of your design studies using Moldex3D/eDesign.

Parallel Computing—High-speed Calculation
Time-to-market has never being so critical in global competition.  The parallel computing technology of Moldex3D/eDesign not only dramatically enhances the calculation performance, but also saves your time -- a reliable 3D analysis can be done during a coffee break!

Intelligence—Cooling & Runner Wizards
Easy-to-use solutions are always appreciated. The intelligence of the Moldex3D/eDesign runner and cooling wizards helps you be more effective.  Now you can easily define runners, sprues, drops and cold slugs; create an entire feeding/cooling system; and quickly optimize the design.

Flexibility—Optimize Your Design
Fed up with the high costs of mold trials or the incomplete design resulted from unexpected compromise with manufacturability?  Moldex3D/eDesign, as a professional advisory tool for part/mold design, provides the opportunity to cost-effectively explore many potential revisions to improve design during any point in the development cycle.

Teamwork—Enhance Cross-department Collaboration
From concept generation through CAD design, tooling and production, the collective intelligence of your key personnel is enhanced by the seamless communication supported by Moldex3D/eDesign. The flexible licensing, user-friendly workflow and approachable interface all make Moldex3D/eDesign a highly-efficient platform for cross-department collaboration and confident decision making.

 

System Requirements :

* Microsoft Windows Vista, Windows XP Professional, Windows XP x64, Windows Server 2008
* Intel Core i7 Series, Intel Xeon, Intel EM64T, MD Athlon, or AMD Opteron -based processor
* 8 GB RAM or greater


For more information of Moldex3D best-in-class 3D technology, please refer to Solid/Shell.

 



 

Moldex3D/eDesign Modules:

eDesign-Flow
Moldex3D/eDesign-Flow

Moldex3D-Flow simulates the entire filling process of injection molding for thermoplastic materials. With the power of Moldex3D-Flow, you can clearly understand how the solid melt flow progresses, accurately identify where solid weld surfaces are, detect short shot problems, predict air trap location, etc.
The explicit analysis capabilities of Moldex3D/eDesign-Flow give you deep insight in solid plastic flow behaviors from macro view to micro view, such as fountain flow, inertia effect and gravity effect. With the power of Moldex3D/eDesign-Flow, you can clearly understand how the solid melt flow progresses, accurately identify where eDesign weld surfaces are, detect short shot problems, etc.


eDesign-Pack
Moldex3D/eDesign-Pack

Moldex3D-Pack incorporates material compressibility (PVT change) in its full 3D Navier-Stokes solver to account for the density variation and melt flow behaviors in packing process for thermoplastic materials. Using Moldex3D-Pack, it can help you to preciously determine gate freeze time, efficient packing time and proper packing pressure to minimize areas of high volumetric shrinkage.
Using Moldex3D/eDesign-Pack, even for thick parts or parts with big thickness changes, you can also investigate all factors in packing process from material choice, gate design, and processing conditions. With true 3D technology, it can help you to preciously determine gate freeze time, efficient packing time and proper packing pressure to minimize areas of high volumetric shrinkage.

eDesign-Cool
Moldex3D/eDesign-Cool

Moldex3D-Cool is a true 3D simulation tool to analyze the mold cooling process. Based on true 3D technology, it is an efficient tool to accurately analyze the mold temperature, the efficiency of cooling channel layout, and the required cooling time. Furthermore, advanced transient cool function supports the simulation of variotherm process to simulate the results of deliberately using higher mold temperature during filling and packing and then dropping the temperature for the remainder of cycle.

eDesign-Warp
Moldex3D/eDesign-Warp

Moldex3D-Warp provides users a true 3D simulation tool to anatomize the causes of shrinkage and warpage and further control these defects before mold is built. With eDesign-Warp, users can easily and efficiently improve the part quality and optimize design.  For fiber-filled material, eDesign-Warp incorporates fiber composite theories and the fiber orientation results from eDesign-Fiber to predict its anisotropic shrinkage and warpage.

eDesign-Fiber
Moldex3D/eDesign-Fiber

Moldex3D-Fiber accurately simulates the 3D fiber orientation in mold-filling process and further calculates the process-induced anisotropic thermo-mechanical properties of fiber-reinforced plastic part. With Moldex3D-Fiber, users can understand the 3D orientation of fiber and further control the anisotropic shrinkage of fiber-reinforced part. The process-induced anisotropic shrinkage and mechanical properties due to fiber orientation are therefore taken into account for accurate warpage prediction.

eDesign-MCM
Moldex3D/eDesign-MCM

Multi-component molding is one of the greatest methods to diversify the development of the plastic molded product fabrication. Moldex3D-MCM simulates the multiple components molding process, including insert molding, overmolding and multi-shot sequential molding. Based on true 3D technology, explicit analysis capabilities of Moldex3D-MCM give you a powerful tool to accurately analyze the interaction behavior of different components and further optimize product design. Moreover, this module helps you to predict the warpage due to property mismatch of different materials, prolonged cooling time and unsymmetrical shrinkage in two-color or overmolding processes...etc.

eDesign-RIM
Moldex3D/eDesign-RIM

Moldex3D-RIM module is a true 3D simulation tool to analyze the reactive injection molding process for thermoset materials. The typical applications include injection molding of unsaturated polyester, polyurethane, liquid silicon rubber, epoxy molding compound, etc. It is capable of simulating cavity filling and curing, part warpage, fiber orientation, multi-component process, etc.

eDesign-I2
Moldex3D/eDesign-I2  

Moldex3D-I2 is a series of interface modules to integrate Moldex3D and famous commerical structural CAE software, including ABAQUS,
ANSYS, MSC.Nastran, NENastran, LS-Dyna, Marc and DigiMat. These modules help users to introduce the process-induced properties, such as fiber orientation or residual stress, into the above-mentioned software to allow users to evaluate the impact of the molding process on the structural performance of the part.

Parallel Computing
Parallel computing

Parallel computing is fast becoming an inexpensive alternative to standard supercomputer for solving large scale problems that arise in scientific and engineering applications. Generally, there are two types of parallel computing platform: (1)Symmetric Multiple Processor, SMP, and (2) Massively Parallel Processing, MPP. The CPUs of a SMP platform share the same memory and are controlled by a single operating system.
eDesign-Viscoelasticity
Moldex3D-Viscoelasticity

Plastic (Polymeric) fluids are often called viscoelastic fluids because they have both viscous and elastic properties. Moldex3D
-Viscoelasticity includes this essential characteristic to effectively predict the flow-induced residual stress and prevent the potential design problem. Furthermore, this stress can also be applied to predict the optical properties and be taken into account in the warpage analysis.


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