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Solid/Shell
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Brochure
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Brochure
Moldex3D/Solid is the world's leading true 3D simulation
solution for in-depth design verification and troubleshooting With
the best-in-class 3D technology based on solid hybrid mesh and
High-Performance Finite Volume Method (HPFVM), Moldex3D/Solid allows
you to optimize product designs and predict manufacturability.
By using
Moldex3D/Solid, users can perform true 3D simulation on the widest
range of application, including thick parts, those that have extreme
thickness changes from thin to thick, those that are difficult to
define a proper midplane model, or those with very complicated part
geometry. Users can directly analyze the solid model without having
to make significant model simplifications. The explicit analysis
capabilities of Moldex3D/Solid provide users deep insight in solid
plastic flow behaviors from macro view to micro view, such as
fountain flow, inertia effect, gravity effect or shear-induced
viscous heating. The intuitive displays help users to evaluate
analysis results in three dimension and clearly address design
defects.
Moldex3D/Solid has been proven by many users to be the most accurate
3D simulation solution. It is capable of simulating the plastics
filling and packing, mold cooling, fiber orientation and part
warpage for thermoplastic injection molding. Additional modules
simulate multi-component molding (MCM) and reactive injection
molding (RIM). Besides, the interface modules (I2) link Moldex3D
with the popular structural analysis software to allow you to
evaluate the interaction of process-induced material anisotropy and
its effects on part structure.
Furthermore, Moldex3D/Solid has been developed with parallel
computing technology in mind. With high-performance parallelized
computing kernel, users can perform analyses on complex models with
much less time than ever.
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Moldex3D/Shell,
which is based on an efficient and robust 2.5D technology, helps you to
in-depth analyze and optimize the design of conventional parts. With the
unique Fast Finite Element Method (FFEM) and meshing technologies, users
can significantly decrease the mid-plane model preparation time and
validate more design iterations.
Moldex3D/Shell
is capable of simulating the plastics filling and packing, mold cooling,
fiber orientation and part warpage for thermoplastic injection molding.
Additional modules simulate gas-assisted injection molding (GAIM),
multi-component molding (MCM) and reactive injection molding (RIM).
Besides, the interface modules link mold-filling and structural analyses
to allow you to evaluate the interaction of part structure and
manufacturability.
After more than
15-year development, Moldex3D/Shell has become the most robust and
reliable analysis tool. With the power of Moldex3D/Shell, users can
quickly predict and solve injection molding manufacturing problems, and
further optimize designs. More
Shell information
Moldex3D/Solid
Modules:
Moldex3D/Solid-Flow
Moldex3D-Flow simulates the entire filling process of
injection molding for thermoplastic materials. With the
power of Moldex3D-Flow, you can clearly understand how
the solid melt flow progresses, accurately identify
where solid weld surfaces are, detect short shot
problems, predict air trap location, etc.
The explicit analysis capabilities of
Moldex3D/Solid-Flow give you deep insight in solid
plastic flow behaviors from macro view to micro view,
such as fountain flow, inertia effect and gravity
effect. With the power of Moldex3D/Solid-Flow, you can
clearly understand how the solid melt flow progresses,
accurately identify where solid weld surfaces are,
detect short shot problems, etc. |
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Moldex3D/Solid-Pack
Moldex3D-Pack incorporates material compressibility (PVT
change) in its full 3D Navier-Stokes solver to account
for the density variation and melt flow behaviors in
packing process for thermoplastic materials. Using
Moldex3D-Pack, it can help you to preciously determine
gate freeze time, efficient packing time and proper
packing pressure to minimize areas of high volumetric
shrinkage.
Using Moldex3D/Solid-Pack, even for thick parts or parts
with big thickness changes, you can also investigate all
factors in packing process from material choice, gate
design, and processing conditions. With true 3D
technology, it can help you to preciously determine gate
freeze time, efficient packing time and proper packing
pressure to minimize areas of high volumetric shrinkage. |
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Moldex3D/Solid-Cool
Moldex3D-Cool is a true 3D simulation tool to analyze
the mold cooling process. Based on true 3D technology,
it is an efficient tool to accurately analyze the mold
temperature, the efficiency of cooling channel layout,
and the required cooling time. Furthermore, advanced
transient cool function supports the simulation of
variotherm process to simulate the results of
deliberately using higher mold temperature during
filling and packing and then dropping the temperature
for the remainder of cycle. |
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Moldex3D/Solid-Warp
Moldex3D-Warp provides users a true 3D simulation
tool to anatomize the causes of shrinkage and warpage
and further control these defects before mold is built.
With Solid-Warp, users can easily and efficiently
improve the part quality and optimize design. For
fiber-filled material, Solid-Warp incorporates fiber
composite theories and the fiber orientation results
from Solid-Fiber to predict its anisotropic shrinkage
and warpage. |
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Moldex3D/Solid-Fiber
Moldex3D-Fiber accurately simulates the 3D fiber
orientation in mold-filling process and further
calculates the process-induced anisotropic
thermo-mechanical properties of fiber-reinforced plastic
part. With Moldex3D-Fiber, users can understand the 3D
orientation of fiber and further control the anisotropic
shrinkage of fiber-reinforced part. The process-induced
anisotropic shrinkage and mechanical properties due to
fiber orientation are therefore taken into account for
accurate warpage prediction. |
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Moldex3D/Solid-MCM
Multi-component molding is one of the greatest
methods to diversify the development of the plastic
molded product fabrication. Moldex3D-MCM simulates the
multiple components molding process, including insert
molding, overmolding and multi-shot sequential molding.
Based on true 3D technology, explicit analysis
capabilities of Moldex3D-MCM give you a powerful tool to
accurately analyze the interaction behavior of different
components and further optimize product design.
Moreover, this module helps you to predict the warpage
due to property mismatch of different materials,
prolonged cooling time and unsymmetrical shrinkage in
two-color or overmolding processes...etc. |
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Moldex3D/Solid-RIM
Moldex3D-RIM module is a true 3D simulation tool to
analyze the reactive injection molding process for
thermoset materials. The typical applications include
injection molding of unsaturated polyester,
polyurethane, liquid silicon rubber, epoxy molding
compound, etc. It is capable of simulating cavity
filling and curing, part warpage, fiber orientation,
multi-component process, etc.
Moldex3D/Solid-RIM helps users to investigate potential
defects in part and runner designs to optimize cavity
filling and curing. With best-in-class 3D technology,
Moldex3D/Solid-RIM provides more accurate analysis
results than ever. Moreover, Moldex3D/Solid-RIM links
seamlessly with InPack, a pre- and post-processor
dedicated for Microchip encapsulation, to calculate the
paddle shift and wire sweep for Microchip encapsulation. |
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Moldex3D/Solid-I2
Moldex3D-I2 is a series of interface modules to
integrate Moldex3D and famous commerical structural CAE
software, including ABAQUS, ANSYS, MSC.Nastran,
NENastran, LS-Dyna, Marc and DigiMat. These modules help
users to introduce the process-induced properties, such
as fiber orientation or residual stress, into the
above-mentioned software to allow users to evaluate the
impact of the molding process on the structural
performance of the part. |
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 Parallel
computing
Parallel computing is fast becoming an inexpensive
alternative to standard supercomputer for solving large
scale problems that arise in scientific and engineering
applications. Generally, there are two types of parallel
computing platform: (1)Symmetric Multiple Processor, SMP,
and (2) Massively Parallel Processing, MPP. The CPUs of
a SMP platform share the same memory and are controlled
by a single operating system. |
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Moldex3D-Optics
Based on three-dimensional filling analysis and
viscoelastic analysis, Moldex3D-OPTICS can precisely
predict the birefringence caused by complicated
process-induced anisotropy in the space. Moreover, this
module not only predicts birefringence in each molding
stage but also integrates the photo-elasticity to
provide the retardation, fringed order and fringed
pattern after a light passing through the part. |
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Moldex3D-Viscoelasticity
Plastic (Polymeric) fluids are often called
viscoelastic fluids because they have both viscous and
elastic properties. Moldex3D
-Viscoelasticity includes this essential characteristic
to effectively predict the flow-induced residual stress
and prevent the potential design problem. Furthermore,
this stress can also be applied to predict the optical
properties and be taken into account in the warpage
analysis. |
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Moldex3D/Solid-IC Package
Moldex3D-IC Package provides a complete true 3D
solution for IC package process, including filling and
curing analysis, warpage prediction, wire sweep
simulation, etc. Highly accurate analysis results enable
users to analyze and further optimize the IC
encapsulation design and process. |
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